Tag Archives ML

1.6Tb class modules are now being developed to meet the raw bandwidth and bandwidth density demands of applications including ‘factory scale’ AI and hyperscale computing. Based on emerging standards from IEEE and OIF, they build upon a solid 800Gb ecosystem and include several new features – both evolutionary and revolutionary. 224G Signaling and FECi The […]

VIAVI has spent decades testing Ethernet as a service, fueling its leadership position in testing modules, cables, and Ethernet ICs at the PHY layer. We also have products that cover the full stack to L7, offering breadth and depth of coverage. A few years ago, we determined current products on the market for high-scale Ethernet […]

We at VIAVI have long been aware of the impact of latency on the datacoms and telecoms ecosystem.  Specialized applications have been developed which allow customers to develop and evaluate ICs, optical modules, ASICs and systems based on their bandwidth throughput and latency. Historically, people have focused on microseconds, but increasingly – especially driven by […]

5G 3GPP

3GPP Release 18, what is it? 3GPP Release 18 is the 4th release of 5G and recognized as the first release of 5G Advanced. Overall, it marks the mid-point of 5G standardization. Significant Updates from Release 17 5G Non-Terrestrial Networks Work was carried out in Release 17 to define the first standardized solutions for 5G […]

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